News Releases

MACOM's new MAOM-005311 and MAOM-005411 are single- and quad-channel 53Gbaud EML drivers with 1.8Vpp output Devices feature very low power and high bandwidth required to support 100G per lambda modules Small form-factor surface-mount packaging to enable 100G and 400G DR and FR modules LOWELL, Mass.

MACOM's new MAOM-006408 features high bandwidth, excellent linearity and low power consumption Device performance offers full analog and digital control for meeting the requirements for both HB-CDM and IC-TROSA standards for 600G deployments. Single die solution enabling 64Gbaud and 64 QAM

Leverages 53Gbaud PAM4 technology with MACOM's PRISM™ and SystemOnGlass™ technology from ColorChip Solution to deliver requisite cost to enable mainstream 100G Single-Lambda PAM-4 deployment 100G Single-Lambda QSFP28 Solution to demo at OFC 2018 at ColorChip Booth #2529 LOWELL, Mass.

MACOM's MATA-03003/3006 TIA solutions with integrated PIN and APD are ideal for next generation 5G wireless, enterprise and storage networks 2 nd Generation TIAs feature low power, high sensitivity/overload and optical sub-assembly flexibility for lower system cost TIA solutions to be showcased at

Silicon Photonics platform enables CWDM4, DR1 and FR4 L-PICs with optimal performance and cost-effectiveness to scale Cloud Data Center and 5G Telecom deployment Automated self-aligning laser to PIC technology to enable breakthrough manufacturing throughput, capacity and cost structure

MACOM's four channel VCSEL driver (MALD-38435) and TIA (MATA-38434) complement existing quad CDRs for a complete, interoperable solution Fully analog solution features high performance and low power at low cost Chipset solution to demo at OFC 2018 with Dust Photonics, MACOM Booth #2613 LOWELL,

GaN-on-Silicon solutions enabling 4G and next generation 5G applications Live demos featuring MACOM's RF Energy Toolkit and RF Plasma Torch Make an appointment to visit MACOM at Booth #418 or connect at our workshops and panels BEIJING --(BUSINESS WIRE)-- MACOM Technology Solutions Inc.

High-performance MAGM Series combines MACOM's established industry leadership in GaN-on-Si and MMIC technologies New MAGM-103436-040A0P delivers wideband performance and superior efficiency compared to LDMOS-based offerings, at comparable cost structures MWC 2018 attendees are invited to visit Hall

Silicon Photonic platform enables CWDM4, DR1 and FR4 L-PICs 400G SR8 QSFP-DD fully analog chipset solution 400G-FR4 solution for next-generation connectivity 5G optical connectivity solutions for SFP28 SR/LR/ER and 100G wireless chipsets LOWELL, Mass.

Make an appointment to visit MACOM at Meeting Room #CC 8.15 and learn about our wireless infrastructure solutions New GaN-on-Silicon solutions enabling 4G and next-gen 5G applications LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Inc. ("MACOM"), will attend Mobile World Congress