MACOM to Drive Cloud Data Centers and 5G Optical Connectivity with L-PIC™-Enabled Solutions for CWDM4
Silicon Photonics platform enables CWDM4, DR1 and FR4 L-PICs with
optimal performance and cost-effectiveness to scale
Cloud Data Centerand 5G Telecom deployment
- Automated self-aligning laser to PIC technology to enable breakthrough manufacturing throughput, capacity and cost structure
- Self-calibration and firmware control optimizes manufacturability scalability
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MACOM's L-PIC platform provides a highly integrated silicon photonic solution targeting specific data center applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Utilizing MACOM's patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment. (Photo: Business Wire)
As the explosive growth of data traffic and insatiable demand forces Cloud Data Centers to rapidly scale their capabilities, MACOM is equipped to be a leader in the transition from 100Gbps to 400Gbps and from 4G to 5G with a cost-effective, high-performance and highly integrated interconnect chipset solution for CWDM4, scalable to FR4 and FR1/DR1 applications.
Core to the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gbps over duplex single mode fiber. MACOM's L-PIC platform provides a highly integrated silicon photonic solution targeting specific data center applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Utilizing MACOM's patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment.
"MACOM is leveraging our L-PIC platforms to enable leading scalability
that meets the rapidly increasing CWDM4 module demand," said
MACOM's L-PICplatform delivers leading bandwidth critical to enabling CWDM4, and is now available in TOSA and at die level. Each L-PIC product includes a companion matched driver and PIC controller. Leveraging this three device chipset, customers are able to significantly reduce engineering risk and achieve faster time-to-market. The accompanying software provides automatic calibration and self-test capabilities, and significantly reduces customers' capital investment required for production lines. Fully integrated and pre-assembled, MACOM's sub-assembly platform is expected to provide the high performance required for achieving 100Gbps and 400Gbps data center links while reducing the transceiver manufacturers' engineering and capital equipment costs, enabling an overall faster time-to-market with lower investment.
MACOM will showcase its optoelectronics portfolio at OFC 2018, Booth
MACOM enables a better-connected and safer world by delivering breakthrough semiconductor technologies for optical, wireless and satellite networks that satisfy society's insatiable demand for information.
Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and datacenters.
Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.
MACOM is the partner of choice to the world's leading communications infrastructure, aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency and field reliability, through its best-in-class team and broad portfolio of analog RF, microwave, millimeterwave and photonic semiconductor products.
MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better, through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.
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This press release contains forward-looking statements based on MACOM's
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important factors could cause actual results to differ materially from
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limited to, those factors described in "Risk Factors" in MACOM's Annual
Report on Form 10-K and Quarterly Report on Form 10-Q filings with the
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