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DateTitle and SummaryView
Mar 12, 2018
MACOM's MATA-03003/3006 TIA solutions with integrated PIN and APD are ideal for next generation 5G wireless, enterprise and storage networks 2 nd Generation TIAs feature low power, high sensitivity/overload and optical sub-assembly flexibility for lower system cost TIA solutions to be showcased at
Mar 12, 2018
Silicon Photonics platform enables CWDM4, DR1 and FR4 L-PICs with optimal performance and cost-effectiveness to scale Cloud Data Center and 5G Telecom deployment Automated self-aligning laser to PIC technology to enable breakthrough manufacturing throughput, capacity and cost structure
Mar 08, 2018
MACOM's four channel VCSEL driver (MALD-38435) and TIA (MATA-38434) complement existing quad CDRs for a complete, interoperable solution Fully analog solution features high performance and low power at low cost Chipset solution to demo at OFC 2018 with Dust Photonics, MACOM Booth #2613 LOWELL,
Mar 06, 2018
GaN-on-Silicon solutions enabling 4G and next generation 5G applications Live demos featuring MACOM's RF Energy Toolkit and RF Plasma Torch Make an appointment to visit MACOM at Booth #418 or connect at our workshops and panels BEIJING --(BUSINESS WIRE)-- MACOM Technology Solutions Inc.
Feb 26, 2018
High-performance MAGM Series combines MACOM's established industry leadership in GaN-on-Si and MMIC technologies New MAGM-103436-040A0P delivers wideband performance and superior efficiency compared to LDMOS-based offerings, at comparable cost structures MWC 2018 attendees are invited to visit Hall
Feb 22, 2018
Silicon Photonic platform enables CWDM4, DR1 and FR4 L-PICs 400G SR8 QSFP-DD fully analog chipset solution 400G-FR4 solution for next-generation connectivity 5G optical connectivity solutions for SFP28 SR/LR/ER and 100G wireless chipsets LOWELL, Mass.
Feb 13, 2018
Make an appointment to visit MACOM at Meeting Room #CC 8.15 and learn about our wireless infrastructure solutions New GaN-on-Silicon solutions enabling 4G and next-gen 5G applications LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Inc. ("MACOM"), will attend Mobile World Congress
Feb 06, 2018
LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Holdings, Inc. (Nasdaq: MTSI) ("MACOM"), a leading supplier of high-performance RF, microwave, millimeterwave and lightwave semiconductor products, today announced its financial results for its fiscal first quarter ended December 29, 2017
Feb 06, 2018
Combines manufacturing scale, supply security, and surge capacity from ST with MACOM's GaN on Silicon RF power products to address mainstream consumer, automotive, and wireless basestation programs ST licenses MACOM's technology to supply GaN on Silicon RF power products Anticipated breakthrough
Feb 01, 2018
LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Holdings, Inc. (NASDAQ: MTSI) (MACOM), a leading supplier of high-performance analog RF, microwave, millimeterwave and lightwave semiconductor products, today announced that John Croteau , President and Chief Executive Officer, Bob

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MACOM Technology Solutions Holdings, Inc. (www.macom.com) designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications.

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