MACOM to Showcase Industry's First X-Band Core Chip, Innovative GaN in Plastic L-Band Module and Highest Power E-Band Power Amplifiers at European Microwave Week 2013
Speak with our experts to solve your unique application design challenges.
Visit MACOM's booth to learn more about the:
- Highest power GaN in Plastic-packaged power transistors
- Integrated GaN modules for the L- and S- frequency bands
- Industry's first X-Band core chipset
- Highest power E-Band MMIC power amplifier
- Lowest power EML driver for 100G optoelectronics applications
- Linear amplifiers for 13/15/18 GHz cellular backhaul
- Broad catalog of 2000+ reliable standard products
Exhibition Hours —
Paper Presentation: Meeting the need for low cost integrated solutions with E/D PHEMT
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For more information please visit: Speakers at EuMW
For more information about European Microwave Week, please visit: http://www.eumweek.com/
For more information about MACOM visit: www.macomtech.com
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Husrav.Billimoria@macomtech.com
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