MACOM Expands 400G PAM-4 Chipset Solution for Data Center Optical Connectivity with New Low Noise Transimpedance Amplifiers
- New MATA-03820 and MATA-03819 TIAs deliver industry-leading low noise performance while supporting bandwidth up to 35 GHz
- Production version TIAs support wire bonding and flip chip assembly flexibility
- MACOM to host product demonstrations at OFC 2019 in the MACOM InnovationZone at booth #2739
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The new MATA-03820 and the MATA-03819 are available in flip chip and wire bonding packaging options, respectively, for fast, flexible deployment in single-lambda 400G-FR4 and DR4 format QSFP-DD and OSFP optical modules. (Photo: Business Wire)
Delivering industry-leading low noise performance less than 1.5 uA RMS typical and supporting bandwidth up to 35 GHz, MACOM’s MATA-03820 and MATA-03819 TIA family supports high throughput optical data links in a very low power profile, optimal for use in high density optical Data Center interconnects. Features include RSSI for photo-alignment and power monitoring, and I2C management interface for control of bandwidth, output amplitude, peaking, loss of signal (LOS), gain and other key parameters.
“Molex is excited to collaborate with MACOM. Leveraging MACOM’s technical support along with its broad portfolio of TIAs we are able to ensure the availability of industry leading 400G optical modules,” said Adit Narasimha, Vice President and General Manager, Molex
“In the rapid evolution to single fiber 100G and parallel fiber 200G and 400G connectivity, we believe that MACOM has again affirmed its leadership position in delivering the high-performance, power-efficient optical components needed to maximize bandwidth density in the
MACOM’s MATA-03820 and MATA-03819 TIAs are available to customers today in production quantities. For more information about the products, visit-
https://www.macom.com/products/product-detail/MATA-03820
https://www.macom.com/products/product-detail/MATA-03819
For customers targeting APD applications, MACOM is now sampling its MATA-03921 (flip chip) and MATA-03919 (wire bonded) TIAs.
MACOM will be hosting demonstrations of their expanded PAM-4 chipset for 100G, 200G and 400G applications at OFC 2019, featuring the MATA-03820 and MATA-03819 TIAs in customer module implementations and a live 200G/400G ROSA demonstration. OFC 2019 attendees are invited to visit with MACOM at the
About Molex:
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit www.molex.com.
Molex is a registered trademark of
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