MACOM and STMicroelectronics to Bring GaN on Silicon to Mainstream RF Markets and Applications
- Combines manufacturing scale, supply security, and surge capacity from ST with MACOM's GaN on Silicon RF power products to address mainstream consumer, automotive, and wireless basestation programs
- ST licenses MACOM's technology to supply GaN on Silicon RF power products
- Anticipated breakthrough cost structure and power density of GaN on Silicon would enable 4G/LTE and massive MIMO 5G antennas
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Through this agreement, MACOM expects to access increased Silicon wafer manufacturing capacity and improved cost structure that could displace incumbent Silicon LDMOS and accelerate the adoption of GaN on Silicon in mainstream markets. ST and MACOM have been working together for several years to bring GaN on Silicon production up in ST's CMOS wafer fab.
Through this agreement, MACOM expects to access increased Silicon wafer manufacturing capacity and improved cost structure that could displace incumbent Silicon LDMOS and accelerate the adoption of GaN on Silicon in mainstream markets. ST and MACOM have been working together for several years to bring GaN on Silicon production up in ST's CMOS wafer fab. As currently scheduled, sample production from ST is expected to begin in 2018.
"This agreement punctuates our long journey of leading the RF
industry's conversion to GaN on Silicon technology. To date, MACOM has
refined and proven the merits of GaN on Silicon using rather modest
compound semiconductor factories, replicating and even exceeding the RF
performance and reliability of expensive GaN on SiC alternative
technology," said
"ST's scale and operational excellence in Silicon wafer manufacturing
aims to unlock the potential to drive new RF power applications for
MACOM and ST as it delivers the economic breakthroughs necessary to
expand the market for GaN on Silicon," said
"Once the
About MACOM
MACOM enables a better-connected and safer world
by delivering breakthrough semiconductor technologies for optical,
wireless and satellite networks that satisfy society's insatiable demand
for information.
Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and datacenters.
Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.
MACOM is the partner of choice to the world's leading communications infrastructure, aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency and field reliability, through its best-in-class team and broad portfolio of RF, microwave, millimeterwave and lightwave semiconductor products.
MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better, through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.
Headquartered in
MACOM, M/
About
ST is a global leader in the
semiconductor market serving customers across the spectrum of sense and
power and automotive products and embedded processing solutions. From
energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and
office, at work and at play, ST is found everywhere microelectronics
make a positive and innovative contribution to people's life. By getting
more from technology to get more from life, ST stands for
life.augmented. In 2016, the Company's net revenues were
Special Note Regarding Forward-Looking Statements
This press
release contains forward-looking statements. Forward-looking statements
include, among others, statements concerning the anticipated development
and manufacturing of GaN on Silicon wafers, the potential uses for such
wafers, potential manufacturing, cost structure and power density
benefits of GaN on Silicon, market adoption of GaN on Silicon and the
pace of such adoption, opportunities within the RF energy market, and
potential RF energy shipments and sales. Forward-looking statements
include all statements that are not historical facts and generally may
be identified by terms such as "anticipates," "believes," "could,"
"estimates," "expects," "intends," "may," "plans," "potential,"
"predicts," "projects," "seeks," "should," "will," "would" or similar
expressions and the negatives of those terms.
These forward-looking statements reflect current views about future
events and are subject to risks, uncertainties, assumptions and changes
in circumstances that may cause those events or actual activities or
results to differ materially from those expressed in any forward-looking
statement. Neither MACOM nor ST can nor does guarantee future events,
results, actions, levels of sales or other activity, performance or
achievements. Readers are cautioned not to place undue reliance on these
forward-looking statements. A number of important factors could cause
actual results to differ materially from those indicated by the
forward-looking statements, including the potential that the parties are
unable to timely deliver the quantities of products targeting
applications at the right price point due to design challenges,
manufacturing bottlenecks, supply shortages, yield issues or otherwise,
the potential that the expected rollout fails to occur, occurs more
slowly than the parties expect or does not result in the amount or type
of anticipated new business, lower than expected demand in the RF market
or other end markets or from OEM customers based on seasonal effects,
regulatory action or inaction, technology shifts, standards changes,
macro-economic weakness or otherwise, the potential for greater than
expected pricing pressure and average selling price erosion based on
attempts to win or maintain market share, competitive factors,
technology shifts or otherwise, the potential inability to ramp GaN on
Silicon products into volume production with acceptable manufacturing
yields to satisfy customer demand in a timely fashion, the potential for
inventory obsolescence and related write-offs, the potential loss of
access to any in-licensed intellectual property or inability to license
technology on reasonable terms, the impact of any claims of intellectual
property infringement or misappropriation, failure to realize the
expected economies of scale, lack of adoption or delayed adoption by
customers and industries of GaN on Silicon, failures or delays in
porting and qualifying GaN on Silicon process technology and achieving
anticipated manufacturing economies of scale, lower than expected
utilization and absorption in the manufacturing process, lack of success
or slower than expected success in developing GaN on Silicon products
under the collaboration, loss of key personnel, loss of business due to
competitive factors, product or technology obsolescence, customer
program shifts or otherwise, the potential for a shift in the mix of
products sold in any period toward lower-margin products, the impact of
supply shortages or other disruptions in supply chains, the impact of
changes in export, environmental or other applicable laws, as well as
those factors described in "Risk Factors" in MACOM's filings with the
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MACOM
Senior Marketing
Communications Specialist
ozzie.billimoria@macom.com
or
Director, Technical Media Relations
michael.markowitz@st.com
Source: MACOM
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