As telecom operators and Internet content providers continue to drive the demand for increased data rates and faceplate density, the OIF is working to support these efforts with components standards for 64 Gbaud and 64 QAM in small form factors. To meet these requirements for smaller size and higher frequency operation, package-level integration of the driver and Mach-Zehnder modulator becomes advantageous. This drives the need for quad-channel linear drivers in a single semiconductor die as compared to existing discrete driver solutions, where multiple die are integrated in a surface mount module.
"We are very excited to be launching this new highly integrated, high
bandwidth modulator driver," said
MACOM's MAOM-006408 raises the technological innovation standard with the integration of four channels in a single Silicon Germanium die with full digital control via Serial Peripheral Interface (SPI). The MAOM-006408 has been optimized for minimum power consumption while also providing flexibility for use with different MZ modulators. It also offers full analog and digital control, which is anticipated to meet the requirements for both the HB-CDM and IC-TROSA standards.
More information on MACOM's new MAOM-006408 driver, along with the
complete portfolio of products for optical communications, will be
available at OFC 2018, MACOM Booth #2613,
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Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and datacenters.
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