News Releases

CoaXPress is emerging as the industry standard of choice for high-speed imaging, featuring bandwidth scalability and long cable reach MACOM's CoaXPress reference design utilizes our award-winning 12G-SDI Cable Driver and Equalizer Reference design available today upon request LOWELL, Mass.

Showcasing Award-Winning Product Portfolio Serving High Data-Rate Video Transport Private Demos Including BNC Connector Reference Designs and 12G-SDI Switcher/Router Visit Booth #N2924 at NAB in Las Vegas , April 24 - 27 LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Inc.

Designed for High Frequency Applications AlGaAs Technology Offers Power Handling and Low Loss Advantages Integrated Bias Current Reduces Piece Part Counts and Manufacturing Costs While Improving Performance LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Inc.

LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Holdings , Inc. (NASDAQ: MTSI) ("MACOM"), a leading supplier of high-performance RF, microwave, millimeterwave and lightwave semiconductor products, today announced it will release second quarter fiscal year 2017 financial results on

64 Gbaud rate with 64 QAM modulation enables > 600 Gbps on a single wavelength Increases faceplate capacity and reduces overall cost-per-bit Enables next generation CFP2-ACO and DCO modules with 3X capacity improvement Demonstration at OFC Booth #1736 LOWELL, Mass.

Enables single wavelength 100G, scalable to 200G and 400G Ethernet Switch-to-Switch and Switch-to-Server Optical Links 53 GBaud PAM-4 chipset and technology to be demonstrated at OFC 2017 LOWELL, Mass --(BUSINESS WIRE)-- MACOM Technology Solutions Inc.

Industry's first integrated Laser and Silicon Photonic Integrated Circuit leveraging Etched Facet Technology (EFT) Production ready chipset delivers the requisite economics to drive the transition from 100G to 400G in data centers Offers customers improved performance, eliminates the need for

Ideal for next generation 5G wireless, enterprise and storage network applications Laser Driver minimizes power consumption, reduces need for external components and provides customers with design flexibility Chipset to be showcased at MACOM's booth #1736 at OFC 2017 LOWELL, Mass.

X-Gene 3 Processor Underscores Readiness for Next-Generation Data Centers SANTA CLARA, Calif. --(BUSINESS WIRE)-- MACOM Connectivity Solutions, LLC ("MACOM"), today announced the sampling of its third generation 16-nanometer FinFET Server-on-a-Chip® (SoC) solution, X-Gene® 3.

LOWELL, Mass. --(BUSINESS WIRE)-- MACOM Technology Solutions Inc. ("MACOM") will debut a newly expanded portfolio of optoelectronics and photonic solutions at OFC 2017 March 21 - 23 in Booth #1736. This Smart News Release features multimedia. View the full release here: